Global IC Packaging Industry Report 2015 is a new market research publication announced by Reportstack. This report is a professional and in-depth study on the current state of the IC Packaging industry.
The report provides a basic overview of the industry including definitions, classifications, applications and industry chain structure. The IC Packaging market analysis is provided for the international markets including development trends, competitive landscape analysis, and key regions development status.
Development policies and plans are also discussed and manufacturing processes and cost structures analyzed. IC Packaging industry import/export consumption, supply and demand figures and cost price and production value gross margins are also provided.
The report provides a basic overview of the industry including definitions, classifications, applications and industry chain structure. The IC Packaging market analysis is provided for the international markets including development trends, competitive landscape analysis, and key regions development status.
Development policies and plans are also discussed and manufacturing processes and cost structures analyzed. IC Packaging industry import/export consumption, supply and demand figures and cost price and production value gross margins are also provided.
To access full report with TOC, please visit Global IC Packaging Industry Report 2015
The report focuses on global major leading industry players providing information such as company profiles, product picture and specification, capacity production, price, cost, production value and contact information. Upstream raw materials and equipment and downstream demand analysis is also carried out. The IC Packaging industry development trends and marketing channels are analyzed. Finally the feasibility of new investment projects are assessed and overall research conclusions offered.
The report focuses on global major leading industry players providing information such as company profiles, product picture and specification, capacity production, price, cost, production value and contact information. Upstream raw materials and equipment and downstream demand analysis is also carried out. The IC Packaging industry development trends and marketing channels are analyzed. Finally the feasibility of new investment projects are assessed and overall research conclusions offered.
Snapshot of TOC with Companies Mentioned
Chapter Seven IC Packaging Key Manufacturers Analysis 65
7.1 ASE 65
7.1.1 Company Profile 65
7.1.2 Product Specification 66
7.1.3 Capacity Production Price Cost Production Value 66
7.1.4 Contact Information 68
7.2 Amkor 68
7.2.1 Company Profile 69
7.2.2 Product Specification 69
7.2.3 Capacity Production Price Cost Production Value 70
7.2.4 Contact Information 72
7.3 SPIL 72
7.3.1 Company Profile 72
7.3.2 Product Specification 73
7.3.3 Capacity Production Price Cost Production Value 74
7.3.4 Contact Information 75
7.4 STATS ChipPac 75
7.4.1 Company Profile 75
7.4.2 Product Specification 76
7.4.3 Capacity Production Price Cost Production Value 77
7.4.4 Contact Information 79
7.5 Powertech Technology 79
7.5.1 Company Profile 79
7.5.2 Product Specification 80
7.5.3 Capacity Production Price Cost Production Value 81
7.5.4 Contact Information 82
7.6 J-devices 82
7.6.1 Company Profile 82
7.6.2 Product Specification 83
7.6.3 Capacity Production Price Cost Production Value 84
7.6.4 Contact Information 85
7.7 UTAC 85
7.7.1 Company Profile 85
7.7.2 Product Specification 86
7.7.3 Capacity Production Price Cost Production Value 86
7.7.4 Contact Information 88
7.8 JCET 88
7.8.1 Company Profile 88
7.8.2 Product Specification 89
7.8.3 Capacity Production Price Cost Production Value 91
7.8.4 Contact Information 93
7.9 ChipMOS 93
7.9.1 Company Profile 93
7.9.2 Product Specification 94
7.9.3 Capacity Production Price Cost Production Value 94
7.9.4 Contact Information 96
7.10 Chipbond 96
7.10.1 Company Profile 96
7.10.2 Product Specification 97
7.10.3 Capacity Production Price Cost Production Value 98
7.10.4 Contact Information 99
7.11 KYEC 99
7.11.1 Company Profile 99
7.11.2 Product Specification 100
7.11.3 Capacity Production Price Cost Production Value 101
7.11.4 Contact Information 102
7.12 STS Semiconductor 103
7.12.1 Company Profile 103
7.12.2 Product Specification 103
7.12.3 Capacity Production Price Cost Production Value 104
7.12.4 Contact Information 105
7.13 Huatian 105
7.13.1 Company Profile 105
7.13.2 Product Specification 106
7.13.3 Capacity Production Price Cost Production Value 107
7.13.4 Contact Information 109
7.14 Carsem 109
7.14.1 Company Profile 109
7.14.2 Product Specification 109
7.14.3 Capacity Production Price Cost Production Value 111
7.14.4 Contact Information 112
7.15 Nepes 112
7.15.1 Company Profile 113
7.15.2 Product Specification 114
7.15.3 Capacity Production Price Cost Production Value 115
7.15.4 Contact Information 117
7.16 FATC 117
7.16.1 Company Profile 117
7.16.2 Product Specification 117
7.16.3 Capacity Production Price Cost Production Value 118
7.16.4 Contact Information 120
7.17 Walton 120
7.17.1 Company Profile 120
7.17.2 Product Specification 120
7.17.3 Capacity Production Price Cost Production Value 121
7.17.4 Contact Information 122
7.18 Unisem 122
7.18.1 Company Profile 122
7.18.2 Product Specification 123
7.18.3 Capacity Production Price Cost Production Value 123
7.18.4 Contact Information 125
7.19 NantongFujitsu Microelectronics 125
7.19.1 Company Profile 125
7.19.2 Product Specification 126
7.19.3 Capacity Production Price Cost Production Value 126
7.19.4 Contact Information 128
7.20 Hana Micron 128
7.20.1 Company Profile 128
7.20.2 Product Specification 128
7.20.3 Capacity Production Price Cost Production Value 129
7.20.4 Contact Information 130
7.21 Signetics 130
7.21.1 Company Profile 130
7.21.2 Product Specification 131
7.21.3 Capacity Production Price Cost Production Value 134
7.21.4 Contact Information 136
7.22 LINGSEN 136
7.22.1 Company Profile 136
7.22.2 Product Specification 136
7.22.3 Capacity Production Price Cost Production Value 137
7.22.4 Contact Information 139
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