Saturday 27 June 2015

New Report Discusses the Key Vendors of Flexible Packaging Adhesives Technology Market in China 2015-2019

Flexible Packaging Adhesives Technology Market in China 2015-2019 is a new market research publication announced by Reportstack. Flexible packaging adhesives are used as bonding agents in flexible packaging. Their characteristics include clarity, strength, and resistance to heat and humidity. Based on the technology used in their production, flexible packaging adhesives can be segmented as water-based, solvent-based, hot-melt, solvent-free, and others.
The analysts forecast that the flexible packaging adhesives technology market in China to grow at a CAGR of 12.37% over the period 2014-2019.
Covered in this Report
The report, Flexible Packaging Adhesives Technology Market in China 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the flexible packaging adhesives market landscape in China and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market.
Key Vendors
• Beijing Comens New Materials
• Coim Group
• Cromogenia-Units
• Dow Chemical 
• Henkel
• Huzhou Ochem Chemical
• Mitsui
• Sapici
• Shanghai KangDa New Materials 
• Toyo Ink Group 
Other Prominent Vendors
  • 3M
    • Ashland
    • BASF
    • Bayer
    • Bostik
    • Cyberbond Adhesives
    • DIC
    • DSM
    • Eastman
    • Evonik
    • H.B. Fuller
    • Jiangxi Ansheng Technology 
    • Master Bond
    • Paramelt Specialty Materials (Suzhou)
    • Rhein Chemie Rheinau
    • ThreeBond Group
    • Wacker China
    • WUXI WanLi Adhesion Materials
  • Market Driver
    • Growth of Flexible Packaging Market in China
    • For a full, detailed list, view our report
    Market Challenge
    • Volatile Prices and Uncertainty in Supply of Feedstock
    • For a full, detailed list, view our report
    Market Trend
    • Growing Popularity of Bio-based Flexible Packaging Adhesives
    • For a full, detailed list, view our report
    Key Questions Answered in this Report
    • What will the market size be in 2019 and what will the growth rate be?
    • What are the key market trends?
    • What is driving this market?
    • What are the challenges to market growth?
    • Who are the key vendors in this market space?
    • What are the market opportunities and threats faced by the key vendors?
    • What are the strengths and weaknesses of the key vendors?

    Companies Mentioned
    Beijing Comens New Materials, Coim Group, Cromogenia-Units, Dow Chemical, Henkel, Huzhou Ochem Chemical, Mitsui, Sapici, Shanghai KangDa New Materials, Toyo Ink Group, 3M, Ashland, BASF, Bayer, Bostik, Cyberbond Adhesives, DIC, DSM, Eastman, Evonik, H.B. Fuller, Jiangxi Ansheng Technology, Master Bond, Paramelt Specialty Materials (Suzhou), Rhein Chemie Rheinau, ThreeBond Group, Wacker China, WUXI WanLi Adhesion Materials
    Contact:
    Debora White
    Manager - Marketing 
    debora@reportstack.com
    Ph: +1-888-789-6604
    Reportstack Market Research
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