Detailed Study of the Global System-in-Package Market 2016-2020

Report: Global System-in-Package Market 2016-2020 is a new market research publication announced by Reportstack.

Report Outline: A SiP contains several chips such as a specialized processor, dynamic random access memory (DRAM), and flash memory. These chips are combined with passive components such as resistors and capacitors, which are placed on one substrate, requiring only a few external components to make it functional. Thus, devices packaged using this technology are ideal for space constrained environments such as smart devices. This reduces integration complexities on the printed circuit board (PCB) as well as making the overall design simpler.

For detailed report with TOC, please click here ​Global System-in-Package Market 2016-2020

Market Growth: The analysts forecast the global SiP market to grow at a CAGR of 10.29% during the period 2016-2020.

Key vendors 
• Amkor Technology
• ASE
• JCET
• SPIL
• UTAC

Other prominent vendors 
• ChipMOS Technology
• ChipSiP Technology
• NANIUM 
• Octavo Systems
• Samsung Electro-Mechanics

Regions Covered: The market is divided into the following segments based on geography: 

• Americas
• APAC
• EMEA

Companies Mentioned

Amkor Technology, ASE, JCET, SPIL, UTAC, ChipMOS Technology, ChipSiP Technology, NANIUM, Octavo Systems, Samsung Electro-Mechanics.

Contact:

Debora White

Manager - Marketing

debora@reportstack.com

Ph: +1-888-789-6604

Reportstack Market Research

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