Global Fan-in Wafer Level Packaging Market Trends and Forecasts 2016-2020

Report :  Global Fan-in Wafer Level Packaging Market 2016-2020 is a new market research publication announced by Reportstack.

Report Outline: Chip-scale packaging (CSP) emerged in the 1990s. By 1998, wafer-level CSPs emerged as the most preferred form of chip packaging solutions due to their low cost benefits in applications, ranging from application-specific integrated circuits (ASICs) and microprocessors to electrically erasable programmable read-only memory (EEPROM). WLP is one of the key trending technologies used for CSP and is gaining popularity among fabless and foundry companies globally.

For detailed report with TOC, please click here ​Global Fan-in Wafer Level Packaging Market 2016-2020.

Market Growth: The global fan-in WLP market to grow at a CAGR of 9.63% during the period 2016-2020.

Key vendors • STATS ChipPAC
• STMicroelectronics
• TSMC
• Texas Instruments

Other prominent vendors • Rudolph Technologies
• SEMES
• SUSS MicroTec
• Ultratech
• FlipChip International

Regions Covered:

• APAC
• North America
• Europe

Companies Mentioned

STATS ChipPAC, STMicroelectronics, TSMC, Texas Instruments, Rudolph Technologies, SEMES, SUSS MicroTec, Ultratech, FlipChip International.

Contact:

Debora White

Manager - Marketing

debora@reportstack.com

Ph: +1-888-789-6604

Reportstack Market Research

###