In-Depth Study on Global ESD Packaging Market 2017-2021

Report : Global ESD Packaging Market 2017-2021 is a new market research publication announced by Reportstack. 

Report Outline: ESD packaging is used for devices or products that can be damaged by electrostatic discharge (ESD). ESD is the sudden flow of electricity between two electrically charged objects. This flow of electricity may result in the damage of devices. ESD packaging is commonly used for packaging printed circuit boards (PCBs) and semiconductors. PCBs are mostly used in industries such as electronics and automotive and are extremely prone to ESD.

For detailed report with TOC, please click here ​Global ESD Packaging Market 2017-2021

Market Growth: The global ESD packaging market to grow at a CAGR of 8.23% during the period 2017-2021.

Key vendors • BASF
• Desco Industries
• Dow Chemical
• PPG Industries

Other prominent vendors • AkzoNobel
• DaklaPack Group
• Dou Yee
• GWP Group
• Kao-Chia Plastics
• Miller Supply
• Polyplus Packaging
• TIP Corporation
• Uline

Regions Covered:

• Americas
• APAC
• EMEA

Companies Mentioned

BASF, Desco Industries, Dow Chemical, PPG Industries, AkzoNobel, DaklaPack Group, Dou Yee, GWP Group, Kao-Chia Plastics, Miller Supply, Polyplus Packaging, TIP Corporation, and Uline.

Contact:

Debora White

Manager - Marketing

debora@reportstack.com

Ph: +1-888-789-6604

Reportstack Market Research

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